TGV Glass Substrate Breaking Machine for controlled singulation of Through Glass Via substrates. CCD vision alignment, low chipping, protects TGV vias, designed for semiconductor advanced packaging.
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Add: No.4 Xinya Road, Dalingya, Daojiao Town,Dongguan City, Guangdong Province, China Zip Code: 523183 Tel: +86-769-88319361 81331281 Fax: +86-769-88319365銆€ After-sales Services Tel: +86-769-81331280 General manager锛歁s.Zhu +8613829263778 Website: www.yinruijixie.com Email: zhuxj@dgyinruijixie.com MSN锛歞gyinrui@hotmail.com Guangdong Dongguan Yinrui Precision Machinery Co., Ltd All Rights Reserved 绮CP澶?7024712鍙?1 Technology Supporting: glassinchina.com
